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Supported By
Dynalog
Texas Instruments
AMD
NXP SOLUTIONS
SYNOPSYS
CYPRESS

Sponsorship Opportunities

Facilities being extended to industries

  • Advertisement in the proceedings
  • Equipment/ Technology display during conference ( Starts )
  • Interaction with delegates for product demonstration
  • Interaction with delegates registered for tutorials.
  • Banners/ Board Advertisement, Banners in registration, Conference, tutorial room & campus.
  • Posters in conference halls & programme schedule boards.

Sponsorship Categories

  • Cash support for the event
  • Sponsorship of the day events ( including high tea & Lunch)
  • Sponsors of items i) Registration Bags ii) Conference Shirts iii) Kit
  • Sponsorship of travel of the foreign dignitaries.

Proceedings in DSP & VLSI

Proceedings will be send to all technical DSP & VLSI institution and all relevant IEEE - societies all across the globe.

1 Normal page / comer 10 – 12 10, 000/-
2 Half page BW Intra Cover 8 Full 30/15,000/-
3 Cover page colour 1/2 2 20,000/-
4 Back page colour 2 40,000/-

Dr. K. S. Rao
Principal
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Latest Updates
20 April 2010
Last date for Paper Submission

10 May 2010
Intimation of Paper Selection

20 May 2010
Confirmation of presentation of paper in conference (by speaker)

30 May 2010
Registration (Early birds)

Contact Us
Dr K S Rao
Principal
ksrao_prn@rediffmail.com
Prof R K Singh
Vice Principal
viceprincipalgnec@gmail.com
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